• 1U Rack Server - H3C UniServer R2700 G3 with Intel Xeon Processor
  • 1U Rack Server - H3C UniServer R2700 G3 with Intel Xeon Processor

1U Rack Server - H3C UniServer R2700 G3 with Intel Xeon Processor

No.UniServer R2700 G3

H3C UniServer R2700 G3

  • Form Factor: 1U Rackmount Server,H3C UniServer R2700 G3 Rack Server

  • Processor: Intel Xeon

  • Brand: H3C

  • Model: UniServer R2700 G3

  • Type: 1U Rack Server

    Physical Dimensions

    • Height: 42.88 mm (1U)

    • Width: 434.59 mm

    • Depth: 768.3 mm (without safety panel) / 780.02 mm (with safety panel)

  • 1U Rack Server - H3C UniServer R2700 G3 with Intel Xeon Processor
  • Description
  • Additional Information
  • Ordering & Payment Terms

Processor (Computing)

  • Processor Type: Up to two Intel® Xeon® Scalable Family Processors

  • Cores: 4, 6, 8, 10, 12, 14, 16, or 20 Cores

  • Main Frequency: 2.5GHz (example), supports processors with a maximum TDP of 125W

  • Performance: Utilizes latest Intel technology for up to 50% performance improvement.

Memory

  • Technology: Six-channel 2666MHz DDR4

  • Slots: Up to 16 slots

  • Types: RDIMM, LRDIMM

  • Maximum Capacity: 2TB

  • Example Modules: 4GB, 8GB, 16GB, 32GB RDIMM

Storage

  • Local Storage Configurations:

    • Maximum 4 LFF (Large Form Factor) front + 2 SFF (Small Form Factor) rear drives.

    • Maximum 10 SFF front + 2 SFF rear drives.

  • Drive Support: SAS, SATA HDD/SSD; 4 front NVMe drives; SATA M.2 options.

  • Storage Controller:

    • Standard: SATA RAID 0/1/10/5

    • Optional: HBA cards, advanced Array cards supporting RAID 0/1/10/5/6/50/60/1E, and PCIe 3.0 Smart Array cards.

  • FBWC (Flash-Backed Write Cache): Supports up to 2GB DDR3-1600MHz cache.

Expansion & Ports

  • PCIe Slots: 4 x PCIe 3.0 slots (2 standard, 1 for array card, 1 for network card).

  • GPU Support: Supports 2 single-wide GPUs.

  • Ports: Rear VGA, serial port, 4 x USB 3.0 (2 rear, 2 internal), optional front VGA, optional 2 MicroSD slots.

  • CD-ROM Drive: Supports external or built-in (on 4 LFF/8 SFF models only).

Networking

  • Management: Embedded 1Gbps dedicated management port.

  • Options: Optional 4 x 1GE ports via mLOM; standard PCIe 3.0 network adapters.

Power & Cooling

  • Power Supply: Hot-swappable, redundant (1+1) power supplies.

    • Options: 550W, 800W, 1200W (Platinum); 800W (Titanium); 800W 336VHDC (Platinum).

  • Cooling: Hot-swappable redundant fans.

Management

  • Tools: HDM agentless management (with independent port) and H3C FIST management software for full life-cycle management.

Environmental & Certifications

  • Operating Temperature: 5°C to 45°C (varies by configuration).

  • Certifications: CCC, CECP, SEPA.

Key Features & Target Applications

  • Space-Efficient Design: Addresses data center space constraints with a high-performance, cost-effective 1U form factor.

  • Balanced Performance: Optimized for workload balance between performance, efficiency, and density.

  • Ideal For:

    • Medium-sized Data Centers: For enterprises and cloud service providers.

    • IT Infrastructure: Core IT applications for SMEs.

    • Distributed Computing: Cloud and big data applications.

    • Virtualization: Medium-density virtual machine (VM) deployment.

  • OS & Hypervisor Support: Supports Microsoft Windows, Linux, VMware, and H3C CAS environments.

Ordering & Payment Terms:

  • Minimum Order Quantity (MOQ): Flexible for small orders
  • Shipping: DDP (Delivered Duty Paid) to your destination or shipment via your designated courier account.
  • Payment Method: T/T (Bank Transfer)
  • Payment Terms:
    30% advance payment, with 70% balance due prior to shipment for bulk orders


BANK INFORMATION

Bank Name: DBS BANK (HONG KONG) LIMITED
Account Name: Shenzhen VAN Electronics Co., Ltd.
Account No.: 798 291 1671
Bank Address: 11th Floor, The Center, 99 Queen's Road Central, Central, Hong Kong
Swift Code: DHBKHKHH

Contact for Quotation:
Kindly email your requirements to sales@szvan.com for a customized quotation and optimal solution.
Attn: Jessica Lee

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