1U Rack Server - H3C UniServer R2700 G3 with Intel Xeon Processor

Processor (Computing)

• Processor Type: Up to two Intel® Xeon® Scalable Family Processors

• Cores: 4, 6, 8, 10, 12, 14, 16, or 20 Cores

• Main Frequency: 2.5GHz (example), supports processors with a maximum TDP of 125W

• Performance: Utilizes latest Intel technology for up to 50% performance improvement.

Memory

• Technology: Six-channel 2666MHz DDR4

• Slots: Up to 16 slots

• Types: RDIMM, LRDIMM

• Maximum Capacity: 2TB

• Example Modules: 4GB, 8GB, 16GB, 32GB RDIMM

Storage

• Local Storage Configurations:

  • Maximum 4 LFF (Large Form Factor) front + 2 SFF (Small Form Factor) rear drives.

  • Maximum 10 SFF front + 2 SFF rear drives.

• Drive Support: SAS, SATA HDD/SSD; 4 front NVMe drives; SATA M.2 options.

• Storage Controller:

  • Standard: SATA RAID 0/1/10/5

  • Optional: HBA cards, advanced Array cards supporting RAID 0/1/10/5/6/50/60/1E, and PCIe 3.0 Smart Array cards.

• FBWC (Flash-Backed Write Cache): Supports up to 2GB DDR3-1600MHz cache.

Expansion & Ports

• PCIe Slots: 4 x PCIe 3.0 slots (2 standard, 1 for array card, 1 for network card).

• GPU Support: Supports 2 single-wide GPUs.

• Ports: Rear VGA, serial port, 4 x USB 3.0 (2 rear, 2 internal), optional front VGA, optional 2 MicroSD slots.

• CD-ROM Drive: Supports external or built-in (on 4 LFF/8 SFF models only).

Networking

• Management: Embedded 1Gbps dedicated management port.

• Options: Optional 4 x 1GE ports via mLOM; standard PCIe 3.0 network adapters.

Power & Cooling

• Power Supply: Hot-swappable, redundant (1+1) power supplies.

  • Options: 550W, 800W, 1200W (Platinum); 800W (Titanium); 800W 336VHDC (Platinum).

• Cooling: Hot-swappable redundant fans.

Management

• Tools: HDM agentless management (with independent port) and H3C FIST management software for full life-cycle management.

Environmental & Certifications

• Operating Temperature: 5°C to 45°C (varies by configuration).

• Certifications: CCC, CECP, SEPA.

Key Features & Target Applications

• Space-Efficient Design: Addresses data center space constraints with a high-performance, cost-effective 1U form factor.

• Balanced Performance: Optimized for workload balance between performance, efficiency, and density.

• Ideal For:

  • Medium-sized Data Centers: For enterprises and cloud service providers.

  • IT Infrastructure: Core IT applications for SMEs.

  • Distributed Computing: Cloud and big data applications.

  • Virtualization: Medium-density virtual machine (VM) deployment.

• OS & Hypervisor Support: Supports Microsoft Windows, Linux, VMware, and H3C CAS environments.

Ordering & Payment Terms:

• Minimum Order Quantity (MOQ): Flexible for small orders
• Shipping: DDP (Delivered Duty Paid) to your destination or shipment via your designated courier account.
• Payment Method: T/T (Bank Transfer)
• Payment Terms:
  30% advance payment, with 70% balance due prior to shipment for bulk orders

BANK INFORMATION

Bank Name: DBS BANK (HONG KONG) LIMITED
Account Name: Shenzhen VAN Electronics Co., Ltd.
Account No.: 798 291 1671
Bank Address: 11th Floor, The Center, 99 Queen's Road Central, Central, Hong Kong
Swift Code: DHBKHKHH

Contact for Quotation:
Kindly email your requirements to sales@szvan.com for a customized quotation and optimal solution.
Attn: Jessica Lee