• 1U 1.6T DCI-BOX 1.0: For Multi-Service, High-Capacity Data Center Interconnect and Transmission Networking
  • 1U 1.6T DCI-BOX 1.0: For Multi-Service, High-Capacity Data Center Interconnect and Transmission Networking

1U 1.6T DCI-BOX 1.0: For Multi-Service, High-Capacity Data Center Interconnect and Transmission Networking

No.1U 1.6T DCI BOX 1.0
  • 1U rack with 4 slots for four 2×200G OTU service cards
  • B/S intelligent and open network architecture
  • Supports Web, CLI, SNMP and other management methods, convenient operation and maintenance
  • Modular design, on-demand configuration, smooth upgrade
  • Supports hot swap and can be flexibly replaced according to requirements
  • Large capacity, ultra-high density on a compact 1U platform
  • Supports 1.6Tbps line-side access and realize bidirectional 1.6Tbps electrical layer processing capability
  • Ultra-low power consumption based on the most advanced single-carrier 200G coherent DSP and photonic integration technology, including CFP2-DCO and terminal optical technology
  • Space-saving modular optical layer function, realize the modularization and miniaturization of various optical layer devices, and flexibly implement optical layer services
  • Front-to-back airflow, reasonable height, width and depth design, adapt to the server rack requirements of the data center computer room, and can be deployed with the server on the same rack
  • Easy to operate and maintain based on the software-defined network (SDN) design concept with open APIs, which can be quickly automated and integrated in any IT operating environment to achieve rapid service deployment
  • Supports unified network management platform based on SNMP, network management methods CLI (Telnet and Console), Web, NetRiver (graphical interface)
  • 1U 1.6T DCI-BOX 1.0: For Multi-Service, High-Capacity Data Center Interconnect and Transmission Networking
  • Description
  • Ordering & Payment Terms
The 1U 1.6T DCI BOX 1.0 is designed for multi-service and high-capacity transmission networking. It is primarily used for interconnecting data centers of telecom operators and internet companies. Additionally, it is suitable for various transmission applications in metro/access aggregation layers and long-haul access networks.

Parameter Specification
Max. Capacity 1.6T
Wavelength Range 1529.16 nm to 1567.14 nm
Frequency Range 191.30 THz to 196.05 THz
Capacity per Wavelength 200G / 100G
Modulation Format QPSK / 8QAM / 16QAM
Physical Network Topology Chain, Star, Ring
Operating Temperature -10 °C to +70 °C
Storage Temperature -40 °C to +80 °C
Relative Humidity 5% to 95% (non-condensing)
Dimensions (W × H × D) 440 mm × 44 mm × 535 mm
Cooling Front-to-back Airflow, FRU Fans
Chassis Structure All-in-one, 19-inch Rack Mountable
Power Supply (AC) 90 V to 264 V, 50/60 Hz
Power Supply (DC) -36 V to -60 V
Safety & EMC Compliance FCC, UL, CE, TUV, CSA
Power Consumption < 350 W

Ordering & Payment Terms:

  • Minimum Order Quantity (MOQ): Flexible for small orders
  • Shipping: DDP (Delivered Duty Paid) to your destination or shipment via your designated courier account.
  • Payment Method: T/T (Bank Transfer)
  • Payment Terms:
    30% advance payment, with 70% balance due prior to shipment for bulk orders


BANK INFORMATION

Bank Name: DBS BANK (HONG KONG) LIMITED
Account Name: Shenzhen VAN Electronics Co., Ltd.
Account No.: 798 291 1671
Bank Address: 11th Floor, The Center, 99 Queen's Road Central, Central, Hong Kong
Swift Code: DHBKHKHH

Contact for Quotation:
Kindly email your requirements to sales@szvan.com for a customized quotation and optimal solution.
Attn: Jessica Lee

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