SZVAN Unveils Liquid-Cooled 800G SiPh Module at CIOE 2025, Shenzhen
September 10–12, 2025 | Shenzhen World Exhibition & Convention Center, China
SZVAN Electronics made its strongest CIOE appearance yet at the 26th China International Optoelectronic Exposition (September 10–12, Shenzhen), unveiling the industry's first immersion liquid-cooled 800G silicon photonics transceiver module.
The new module combines SZVAN's proven 800G SiPh optical engine with a proprietary hermetic seal and coolant-compatible housing, enabling direct immersion in dielectric cooling fluids. Live demonstrations showed the module operating at full 800G line rate while submerged, with a case temperature 30°C below air-cooled alternatives.
"AI data centers are hitting thermal walls," said SZVAN's immersion cooling chief engineer. "Our liquid-cooled 800G SiPh module eliminates the thermal bottleneck, allowing data center operators to pack more bandwidth per rack without exceeding power budgets."
CIOE 2025 also served as the launchpad for SZVAN's 72-hour burn-in testing protocol, a new quality standard that subjects every production module to extended thermal and optical stress testing before shipment. The protocol was developed in response to customer demand for zero-defect delivery in mission-critical AI data center environments.
SZVAN reported a record 120+ qualified leads from CIOE 2025, with the liquid-cooled 800G SiPh module generating the highest interest. The company also signed three new OEM private-label agreements with Chinese cloud infrastructure providers.
