September 11–13, 2024  |   Shenzhen World Exhibition & Convention Center, China

SZVAN Electronics returned to CIOE 2024 (September 11–13, Shenzhen World Exhibition & Convention Center) with a significantly expanded booth and a bold new product focus: immersion liquid cooling for optical modules.

As AI workloads drive data center power consumption to unprecedented levels, SZVAN introduced its proprietary liquid-cooled 400G and 800G transceiver modules, designed for direct immersion in dielectric coolant fluids. A live demonstration showed an 800G QSFP-DD module operating fully submerged in a transparent cooling tank, maintaining temperatures 25°C lower than air-cooled equivalents.

"This is the future of data center thermal management," said SZVAN's immersion cooling product manager. "Our liquid-cooled modules reduce PUE by up to 0.3 points and enable higher port densities per rack because you no longer need massive airflow channels."

The immersion cooling demonstration was the most-photographed exhibit in SZVAN's booth history, drawing crowds of Chinese cloud providers, colocation operators, and international buyers. SZVAN also reported strong demand for its 800G QSFP-DD800 production modules, with domestic orders outpacing supply.

On the OEM front, SZVAN signed two new private-label agreements with Chinese systems integrators, and collected 80+ qualified leads across its five product lines.